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Copper clad steel wire (CCS wire) is a versatile and cost-effective solution for grounding systems in electrical and telecommunications applications. Combining the strength of steel with the conductivity of copper, CCS wire offers durability and reliable performance.
Why Use Copper Clad Steel Wire for Grounding?
High Conductivity with Lower Cost
The copper layer ensures good electrical conductivity, while the steel core provides strength.
Compared to solid copper wire, CCS wire is more affordable while still meeting grounding requirements.
Corrosion Resistance
The copper coating protects the steel core from rust, extending the wire’s lifespan.
Bare steel wire is more prone to corrosion, especially in humid or salty environments.
Mechanical Strength
Steel gives the wire high tensile strength, making it resistant to breakage during installation.
Solid copper wire is softer and may stretch or deform under tension.
Lightweight Yet Durable
CCS wire is lighter than solid copper, reducing installation effort without sacrificing durability.
Copper Clad Steel vs. Solid Copper vs. Bare Steel Wire
| Feature | Copper Clad Steel Wire | Solid Copper Wire | Bare Steel Wire |
|---|---|---|---|
| Conductivity | High (copper layer) | Very High | Low |
| Strength | High (steel core) | Low | High |
| Corrosion Resistance | Good (copper coated) | Excellent | Poor |
| Cost | Moderate | High | Low |
| Lifespan | Long | Very Long | Short |
Applications of Copper Clad Steel Grounding Wire
Electrical Substations – Provides a stable grounding connection for high-voltage systems.
Telecommunication Towers – Ensures lightning protection and signal grounding.
Industrial Facilities – Used in grounding grids to prevent electrical faults.
Renewable Energy Systems – Protects solar farms and wind turbines from surges.
Installation Tips for CCS Grounding Wire
Use proper crimping tools to avoid damaging the copper layer.
Ensure connections are tight to maintain conductivity.
Inspect periodically for wear or corrosion, especially in harsh environments.
